(footprint "SAMTEC_FTSH-107-01-F-DV-K" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at -2.27 -5.315) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9920bc98-c84e-46c3-8d48-87c7f1e32b25)
  )
  (fp_text value "SAMTEC_FTSH-107-01-F-DV-K" (at 10.43 5.295) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp dad97f58-088b-43cd-9054-a8c8e0119e46)
  )
  (fp_line (start -4.53 -1.715) (end -4.53 -1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 781824af-78fb-4f6d-ad86-4be6387231e0))
  (fp_line (start -4.53 1.715) (end -4.53 -1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 7762486b-4c39-4bb5-b16b-d2610c2bb23c))
  (fp_line (start -4.53 1.715) (end -4.53 1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp a6c24548-a5db-40a3-b16e-7f0ff54b5b61))
  (fp_line (start 4.53 -1.715) (end 4.53 -1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 6e7f2cef-f365-4b62-bfde-7aa3dfbb46a2))
  (fp_line (start 4.53 -1.715) (end 4.53 1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 29ef6e98-9c73-4b90-9029-cf72e83ee6bb))
  (fp_line (start 4.53 1.715) (end 4.53 1.715)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp a7fa4cf8-9bc3-4b7f-9ad7-13b40c0e454e))
  (fp_circle (center -5.095 2.035) (end -4.995 2.035)
    (stroke (width 0.2) (type solid)) (fill none) (layer "F.SilkS") (tstamp ae5fe42e-695d-4faa-9a7e-5eda4b71a0d8))
  (fp_line (start -4.695 -3.68) (end 4.695 -3.68)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp eab0dea8-e9ed-435b-9542-c214262dd46f))
  (fp_line (start -4.695 3.68) (end -4.695 -3.68)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp c25b1d91-544a-420a-9bd8-204b67977366))
  (fp_line (start 4.695 -3.68) (end 4.695 3.68)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 7a9fc7cf-87d5-4e48-aa05-51aec5c7dd5f))
  (fp_line (start 4.695 3.68) (end -4.695 3.68)
    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 798c2b2e-87e4-4d3e-9f19-d2e142f256f5))
  (fp_line (start -4.445 -1.715) (end 4.445 -1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 4ebaee7d-6bcb-43a2-a5ed-590849232a50))
  (fp_line (start -4.445 -1.715) (end 4.445 -1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp b5211676-2abe-4520-9794-b395472195d3))
  (fp_line (start -4.445 1.715) (end -4.445 -1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 013a025d-2d35-479e-8aab-dc5cb3c82a93))
  (fp_line (start -4.445 1.715) (end -4.445 -1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp b0db0853-cf80-48b8-8a2c-522b55985726))
  (fp_line (start 4.445 -1.715) (end 4.445 1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 32c8566e-566d-4d37-a1b4-08380df14589))
  (fp_line (start 4.445 -1.715) (end 4.445 1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 43e03126-724c-4c89-8a35-9ca95f3205d4))
  (fp_line (start 4.445 1.715) (end -4.445 1.715)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 5a874f10-f4a0-4ac4-98bd-a3e9e3d23fac))
  (fp_circle (center -5.095 2.035) (end -4.995 2.035)
    (stroke (width 0.2) (type solid)) (fill none) (layer "F.Fab") (tstamp f72d01e9-5aae-48e3-beb0-bfeb26f724fc))
  (pad "1" smd rect (at -3.81 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 942402ab-41d9-4c00-96ba-8a128440cc47))
  (pad "2" smd rect (at -3.81 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 220238ec-0c14-446b-b29c-c29affa56854))
  (pad "3" smd rect (at -2.54 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp f6ea2b74-7bc2-4bd8-9e95-88ef8d975022))
  (pad "4" smd rect (at -2.54 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 4a0f6afc-13f5-4fcf-aa83-d246a6557606))
  (pad "5" smd rect (at -1.27 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 378ddcfa-a06b-48f8-a79a-522ecdd7bff7))
  (pad "6" smd rect (at -1.27 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 5aa9611e-19e2-451b-bee9-d62cdf73b47d))
  (pad "7" smd rect (at 0 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 12a408a6-2769-4c7e-ab75-6036d0665817))
  (pad "8" smd rect (at 0 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp bfc22088-bfaf-423a-9b56-553da00d9488))
  (pad "9" smd rect (at 1.27 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 5eaee646-5dcc-4ca0-ae26-3f0ba9b6f2bf))
  (pad "10" smd rect (at 1.27 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp ffcc78b9-6893-46f3-bc2f-98fc1ed4b51c))
  (pad "11" smd rect (at 2.54 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp bfc658db-be83-40dc-b401-390ee9d5b0f5))
  (pad "12" smd rect (at 2.54 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 9fb47560-bdf8-48e9-b7ac-9da7023e68d1))
  (pad "13" smd rect (at 3.81 2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 3a2b0fad-9524-4c23-88fd-31db3b4537ba))
  (pad "14" smd rect (at 3.81 -2.035) (size 0.74 2.79) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 8a3cba37-4e1d-462c-a83d-fcc248ab50b7))
)