feat: board design + consolidation with software

1 files changed, 0 insertions, 64 deletions

diff --git a/footprints.pretty/TAOGLAS_EMPCB.SMAFSTJ.B.HT.kicad_mod b/footprints.pretty/TAOGLAS_EMPCB.SMAFSTJ.B.HT.kicad_mod
deleted file mode 100644
index e8131f8..0000000
--- a/footprints.pretty/TAOGLAS_EMPCB.SMAFSTJ.B.HT.kicad_mod
+++ /dev/null
@@ -1,64 +0,0 @@
-(footprint "TAOGLAS_EMPCB.SMAFSTJ.B.HT" (version 20221018) (generator pcbnew)
-  (layer "F.Cu")
-  (attr smd)
-  (fp_text reference "REF**" (at -0.13514 -3.84871) (layer "F.SilkS")
-      (effects (font (size 1.000961 1.000961) (thickness 0.15)))
-    (tstamp 24161df9-4f85-43aa-ba39-afb3594aa704)
-  )
-  (fp_text value "TAOGLAS_EMPCB.SMAFSTJ.B.HT" (at 13.20051 12.745575) (layer "F.Fab")
-      (effects (font (size 1.000039 1.000039) (thickness 0.15)))
-    (tstamp d418addb-6d2b-4e93-bfe9-4ea197d9e59d)
-  )
-  (fp_text user "PCB EDGE" (at 3.80679 2.10375) (layer "F.Fab")
-      (effects (font (size 0.320572 0.320572) (thickness 0.15)))
-    (tstamp 70b63b16-0c5a-4071-bc29-345a2b9205d7)
-  )
-  (fp_line (start -1.9 -1.52) (end -0.8 -1.52)
-    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp b1146bef-b2fe-4679-8740-494e8f3ded77))
-  (fp_line (start -1.9 2.28) (end -0.8 2.28)
-    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 83710ebe-23db-492d-9958-8fa086d2bcc3))
-  (fp_line (start 0.8 -1.52) (end 1.9 -1.52)
-    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 9db7729b-2265-44e5-8abe-dd6ccf130d94))
-  (fp_line (start 0.8 2.28) (end 1.9 2.28)
-    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 92abb6fd-5a91-459c-a0b6-8a672001f8ad))
-  (fp_circle (center -0.073 -2.888) (end 0.027 -2.888)
-    (stroke (width 0.3) (type solid)) (fill none) (layer "F.SilkS") (tstamp 05bb6c73-e6d5-41ba-b8ad-f5759da14279))
-  (fp_line (start -3.52 -2.53) (end 3.52 -2.53)
-    (stroke (width 0.05) (type solid)) (layer "B.CrtYd") (tstamp 9bf37189-6723-4c34-a26a-e4d6243383af))
-  (fp_line (start -3.52 12.03) (end -3.52 -2.53)
-    (stroke (width 0.05) (type solid)) (layer "B.CrtYd") (tstamp 1de4e649-c7d5-460a-b066-9c478643a67f))
-  (fp_line (start 3.52 -2.53) (end 3.52 12.03)
-    (stroke (width 0.05) (type solid)) (layer "B.CrtYd") (tstamp 8bc7f497-29e9-4dd7-8807-6082cdfe5364))
-  (fp_line (start 3.52 12.03) (end -3.52 12.03)
-    (stroke (width 0.05) (type solid)) (layer "B.CrtYd") (tstamp 5bad2a76-9920-4284-8592-033101fcb8fb))
-  (fp_line (start -3.52 -2.53) (end 3.52 -2.53)
-    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 88b7e25d-7d30-4adb-8939-e871fdff581c))
-  (fp_line (start -3.52 12.03) (end -3.52 -2.53)
-    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 69027d40-8b83-40a4-bf44-168f4139eff6))
-  (fp_line (start 3.52 -2.53) (end 3.52 12.03)
-    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 94851f8d-0e45-4bab-b131-5b5fc889995f))
-  (fp_line (start 3.52 12.03) (end -3.52 12.03)
-    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 5aa8da51-6b49-416f-80ea-44598a14d64a))
-  (fp_line (start -3.175 -1.52) (end 3.175 -1.52)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 06364ff7-a5ce-4fc9-9692-b115b9c12505))
-  (fp_line (start -3.175 2.28) (end -3.175 -1.52)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 65abc160-8b62-4328-a7ff-c922523b0d7b))
-  (fp_line (start -3.175 2.28) (end 5 2.28)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 602cac50-84ae-4a41-b867-d5c0a8e515bd))
-  (fp_line (start -3.175 11.78) (end -3.175 2.28)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 2cadd35a-0ab2-46c1-88d4-008f8e1bc0b8))
-  (fp_line (start 3.175 -1.52) (end 3.175 11.78)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 04182b64-688f-48e8-8819-1201a3b94dcc))
-  (fp_line (start 3.175 11.78) (end -3.175 11.78)
-    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 33390989-e8ca-49ed-836c-2b52d4b841dd))
-  (pad "1" smd rect (at 0 0) (size 0.85 4.56) (layers "F.Cu" "F.Paste" "F.Mask")
-    (solder_mask_margin 0.102) (tstamp 81f03218-6ed9-486f-943c-a82fefec61bd))
-  (pad "2" smd rect (at -2.77 0) (size 1 4.56) (layers "F.Cu" "F.Paste" "F.Mask")
-    (solder_mask_margin 0.102) (tstamp 7613dbf9-3f1d-40cc-b1ad-f56498b0f792))
-  (pad "2" smd rect (at -2.77 0) (size 1 4.56) (layers "B.Cu" "B.Paste" "B.Mask")
-    (solder_mask_margin 0.102) (tstamp 60c5ee77-59f7-4a73-b667-19b75cd297eb))
-  (pad "2" smd rect (at 2.77 0) (size 1 4.56) (layers "F.Cu" "F.Paste" "F.Mask")
-    (solder_mask_margin 0.102) (tstamp 2a787d1f-9790-4394-aece-34c49a78b561))
-  (pad "2" smd rect (at 2.77 0) (size 1 4.56) (layers "B.Cu" "B.Paste" "B.Mask")
-    (solder_mask_margin 0.102) (tstamp 623501c2-e383-43c7-9856-ea175d509515))
-)